Electronics

The front end of electronic assembly includes all processes used to mount electronic components on the surface (SMT process) or through-hole (THT process) of a bare printed circuit board (PCB). SEMO supplies a very wide range of feeders for placement machines, enabling automatic processing of so-called exotic components.

The back end of electronic assembly includes all processes involved in packaging an assembled printed circuit board (PCBA) to produce a finished electronic product. It includes processes such as depanelling, screwing, riveting, press-fitting, dispensing, soldering, functional testing, etc., as well as certain manual processes. SEMO has mastered all of these processes over many years. We support our customers with advice and comprehensive solutions for their electronic production. These include either standard process machines developed by SEMO or customised solutions that integrate third-party processes.

Beyond the safety, ergonomics and performance requirements applicable in any sector, the electronics industry has very specific requirements.
Electrostatic discharge (ESD) must be strictly limited to prevent damage to electronic products. All SEMO machines are therefore built in accordance with the applicable ISO 61340-5 standards, in particular with the use of materials suitable for these environments. In addition, the SEMO production plant has a dissipative floor, which, during the testing phase or for small production runs, allows production to take place on our premises in compliance with ESD requirements.
Furthermore, technical cleanliness is often essential; no impurities must affect the subsequent operation of the product. SEMO equipment is designed to prevent the generation or accumulation of dust, in accordance with ISO 16232 standards. It is intended for use in grey or white rooms, for which SEMO's intervention teams are trained.